STM’s ultra-small silicon pressure sensors use innovative MEMS technology to provide extremely high pressure resolution, in ultra-compact and thin packages.
The devices are designed using STM’s VENSENS technology, allowing the fabrication of pressure sensor on a monolithic silicon chip, eliminating wafer-to-wafer bonding and maximizing reliability.
Key technical features of STM’s pressure sensor family include enhanced temperature compensation that allows apps to perform consistently in changing environments, an absolute pressure range from 260 to 1260 hPa that covers all possible user altitudes (from the deepest mines to the top of Mount Everest), low power consumption less than 4μA, and pressure noise lower than 1Pa RMS.
ST’s pressure sensors are increasingly being used in smartphones, tablets and wearable technology such as sports watches, smart watches, and fitness bands, enabling accurate floor detection and enhanced location-based services, allowing more accurate dead-reckoning calculations, and opening the door to new smartphone apps such as weather analyzers, health and sports monitors.
Evaluation Boards
The general purpose evaluation boards are here.
- X-NUCLEO-IKS01A1
Motion MEMS and environmental sensor expansion board for STM32 Nucleo
On this board there are the sensors listed below.
LSM6DS0: MEMS 3D accelerometer (±2/±4/±8 g) + 3D gyroscope (±245/±500/±2000 dps)
LIS3MDL: MEMS 3D magnetometer (±4/ ±8/ ±12/ 16 gauss)
LPS25H: MEMS pressure sensor, 260-1260 hPa absolute digital output barometer
HTS221: capacitive digital relative humidity and temperature
DIL 24-pin socket available for additional MEMS adapters and other sensors (UV index)
Tutorial
How to install the SW
How to use the SW package
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